Editorial Type:
Article Category: Research Article
 | 
Online Publication Date: 21 Sept 2006

Integration of Numerical Simulation and Flow Visualization in the Design of Equipment for the Manufacture of Submicron Semiconductor Devices

Page Range: 19 – 24
DOI: 10.17764/jiet.1.32.3.j2q861606775j7n7
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Improved room and equipment aerodynamics can have a significant impact on the ability to obtain acceptable yields on high density semiconductor products.1 Goals for the equipment engineer/vendor are presented here, a set of design guidelines is established, and a design and test regimen formulated to achieve aerodynamically acceptable equipment designs is proposed.

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